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System Performance Boosting

DENSITY OPTIMIZED SERVERS

High density servers that provide HPC design and engineering you need for all power budgets, densities, and network configurations.

System Performance Boosting

DENSITY OPTIMIZED SERVERS

High density servers that provide HPC design and engineering you need for all power budgets, densities, and network configurations.

TURNKEY & SCALABLE SOLUTIONS

QUICK ON-SITE DEPLOYMENT

ACCESS TO THE LATEST AND GREATEST TECH

POWER AND SPEED TO ENSURE YOUR SUCCESS

TURNKEY & SCALABLE SOLUTIONS

QUICK ON-SITE DEPLOYMENT

ACCESS TO THE LATEST AND GREATEST TECH

POWER AND SPEED TO ENSURE YOUR SUCCESS

HIGH DENSITY SERVERS THAT MEET YOUR DEMANDS

Custom designed for your hyperscale and HPC workloads, built with understanding of power and space limitations that you may have.

Featured 16-Node System

MicroCloud C-415a

16-Node System Designed for Hyperscale and Cost Effectiveness

Optimized for scale-out, high performance at maximum density, and efficiency to lower Total Cost of Ownership (TCO). Full suite of management software included.

Ideal for:
  • Web Hosting
  • Cloud Computing
  • Web Cache, CDN
  • Application Delivery
ICC Microcloud System

16 Nodes in a 4U Platform

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Memory (Per Node)
» 4 DDR4 DIMM slots
» DDR4 ECC/non-ECC UDIMM
» Up to 32GB per DIMM (128 GB maximum)
» Optional ECC Support
Connections (per node)
» 1 PCIe 4.0 x16
» Up to 4 M.2 (PCIe 4.0 x4 or SATA 6Gb/s)
» Up to 2 SATA 6Gb/s (supports RAID 0,1,10) (Air Cooled)
Networking
» 2 RJ45 (10GbE), 2 RJ45 (1GbE)
Management
» IPMI
» AST2500
CPU /// Up to Ryzen 9 5950X
» 16 Cores/32 Threads
» Base Clock: 3.4 Ghz, Boost Clock: 4.9 GHz
» 64MB cache
Cooling
» Air cooled
» Liquid cooled option

ICC is #1 in HPC

DENSITY OPTIMIZED SERVERS

ICC provides the design and engineering you need for power budget, density and networks configurations. 

Intel Integrated High Density Server

Form Factor
Processor
RAM
Networking
Storage
NVMe
Cards
NVMe
2U - 4 Nodes Twin Server
Dual Intel® Xeon® scalable processors
Up to 3TB DDR4 2933MHz in 12 dimms
Intel® X550-BT2, 2x 10GBase-T LAN, 1x RJ45 Dedicated IPMI
Onboard
2x 2.5″ Hot-Swap
3x PCIe 3.0 x16 (Low Profile)
1x OCP (Mezzanine Slot)
Redundant 750W High Efficiency Platinum
AMD Integrated Enterprise Servers

AMD Integrated High Density Server

Form Factor
Processor
RAM
Networking
Storage
NVMe
Cards
NVMe
2U - 4 Nodes Twin Server
Dual AMD EPYC™ 7003 series processor family
Up to 2TB DDR4 3200MHz in 16 dimms
Intel® I350-AM2, 2x 1GbE LAN, 1x RJ45 Dedicated IPMI
Onboard
1x M.2
6x 2.5″ Hot-Swap
2x PCIe 3.0 x16 (Low Profile)
1x OCP (Mezzanine Slot)
Redundant 1200W 80 PLUS Platinum
Press Release

ENERGY SAVING, PERFORMANCE MAXIMIZED LIQUID COOLED HPC SOLUTION

ICC Joins forces with AMD and ASETEK to deliver flexible, proven and reliable rack-level liquid cooled solutions for HPC with increased density and 80kW CDU capacity per rack.

“ICC’s new custom liquid cooling solution enables high performance AMD processors in clusters with high interconnect densities, while reducing overall data center cooling costs,” noted ICC’s Director of Development, Alexey Stolyar, “the energy saving and maximized performance is uniquely suited for the HPC environments.”

Press Release

ENERGY SAVING, PERFORMANCE MAXIMIZED LIQUID COOLED HPC SOLUTION

ICC Joins forces with AMD and ASETEK to deliver flexible, proven and reliable rack-level liquid cooled solutions for HPC with increased density and 80kW CDU capacity per rack.

“ICC’s new custom liquid cooling solution enables high performance AMD processors in clusters with high interconnect densities, while reducing overall data center cooling costs,” noted ICC’s Director of Development, Alexey Stolyar, “the energy saving and maximized performance is uniquely suited for the HPC environments.”

1U - 4U Form Factor

PLATFORMS

Nodes

NODES

Driver Bays

DRIVE BAYS

Processors

PROCESSORS

Intel Integrated

High Density Servers

AMD Integrated

High Density Servers

PREMIER PARTNERSHIPS WITH

INDUSTRY LEADERS

Long-standing partnerships with industry-leading manufacturers allow us access to components even in the most uncertain of economic climates.

Supermicro
AMD
NVIDIA
Micron
Western Digital
ASRock
Samsung
Intel

PREMIER PARTNERSHIPS WITH

INDUSTRY LEADERS

Long-standing partnerships with industry-leading manufacturers allow us access to components even in the most uncertain of economic climates.

AMD   SupermicroNVIDIAIntelSamsungGigabyteSeagateAsRock

CONTACT US!