TURNKEY HIGH PERFORMANCE CLUSTERS POWERED BY AMD EPYC™ PROCESSORS WITH AMD 3D V-CACHE™ TECHNOLOGY
ENGINEERING JEDAI CLUSTER
TURNKEY & SCALABLE SOLUTION
QUICK ON-SITE DEPLOYMENT
ACCESS TO LATEST AND GREATEST TECH
POWER & SPEED OPTIMIZED
ACCELERATE TIME TO INSIGHT
Featuring the latest generation hardware and JedAI Cloud software, our turnkey offering is built on 3rd Gen AMD EPYC™ Family Processors to maximize workload acceleration, boost memory and performance.
Our expert team has designed low, medium, and high spec cluster solutions optimized for analytical and simulation-lead workloads including computational fluid dynamics(CFD), finite element analysis (FEA), and exploratory data analysis (EDA).
AMD EPYC™ POWERED HARDWARE
CLUSTERS FOR ANY SCALE
Our expert team has designed low, medium, and high spec cluster solutions, optimized for Technical Computing and Simulation-driven workloads.
Low Spec Cluster
Medium Spec Cluster
1x Deployment Node
1x AMD Compute Node
3x Controller Nodes
1x Samsung Storage Node
1x GPU Node
6x Ceph Storage Nodes
JedAI Cloud Software
High Spec Cluster
1x Deployment Node
1x AMD Compute Node
3x Controller Nodes
2x Samsung Storage Node
2x GPU Node
12x Ceph Storage Nodes
JedAI Cloud Software
JedAI BUILDING BLOCKS
TURNKEY CLUSTER HARDWARE
Featuring the latest and most powerful server architecture available on the market
GPU ACCELERATION
Latest gen GPUs
Our Turnkey Cluster solutions offer up to 8x GPUs, delivering unprecedented compute performance to aid the discovery of new drugs, uncover genetic mutations to better fight disease, and drive healthcare innovation.
NVMe Storage
Samsung Storage
High-performing drives from Samsung boost performance and reliability, no matter how intensive the workload.The NVMe storage block comes pre-integrated with a modern file system that accelerates the data pipeline.
AMD COMPUTE
Latest gen CPUs
We offer the latest generation CPU options from industry veterans AMD, built to handle large scientific and engineering datasets with top performance – ideal for HPC workloads, compute-intensive models, and analysis techniques.
Networking
High speed Interconnect
High Performance clusters require flexible, high-speed connections. High speed interconnect accelerates and offloads data transfers to ensure compute resources never “go hungry” and simplifies infrastructure automation so applications run faster.
DESIGNED TO BE THE WORLD’S HIGHEST PERFORMANCE X86 SERVER PROCESSORS FOR TECHNICAL COMPUTING
AMD EPYC™ 7003 SERIES PROCESSORS
AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology triple the amount of available L3 cache to 768MBs per socket versus standard EPYC 7003 series, helping deliver faster time-to-results on targeted workloads like EDA, CFD, and FEA software and solutions while providing socket compatibility with existing AMD EPYC™ 7003 platforms. By increasing the pool of L3 cache that is lower latency and closer to the core than main memory, AMD EPYC™ 7003 Processors with AMD 3D V-Cache utilize the same shared memory architecture as the rest of the 3rd Generation EPYC™ family. That means customers can now take advantage of a full up to 96MB of L3 cache per CCD without sacrificing performance, even on lower core count and mainstream EPYC 7003 processors.
AMD 3D V-CACHE™ TECHNOLOGY
Built on ground-breaking AMD 3D Chiplet architecture and using 7nm process technology, AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology employ leading-edge logic stacking based on copper-to-copper hybrid bonding “bumpless” chip-on-wafer process to enable over 200X the interconnect densities of current 2D CPU technologies (and over 15X the interconnect densities of other 3D CPU technologies using solder bumps), helping lower latency, boost bandwidth, and enhance power and thermal efficiencies.
BREAKTHROUGH PERFORMANCE PER CORE
AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology can run on existing AMD EPYC™ 7003 platforms* and are built to optimize workloads like EDA, CFD, and FEA. Having access to 768MB of L3 cache helps improve performance and speeds up simulation workloads by continuously feeding each processor core up to 96MB of L3 cache per CCD without having to access main memory outside of the CPU.
HELPING TO LOWER TCO
AMD is serious about security. All AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology comes standard with Infinity Guard, a state-of-the-art set of modern security features that help decrease potential attack surfaces as software is booted, executed, and processes your critical data.
EXCEPTIONAL ENERGY EFFICIENCY
AMD is charting a bold path to advance energy efficiency. AMD EPYC™ 7003 Processors with AMD 3D V-Cache are designed with energy efficiency in mind. High performance in technical computing can result in fewer servers deployed while reducing power consumption, real estate needs, administration costs and assisting in the reduction of total cost of ownership..
SIMPLIFIED CLOUD SOLUTIONS
TURNING HARDWARE INTO AN ENGINEERING CLUSTER
JEDAI CLOUD SOFTWARE
When developing a turnkey cluster solution, we adopt a layered approach, starting with the end-user requirements at the application level and working down the stack to the hardware that will ultimately deliver the resources. The goal of our software is to plug the gap between end user expectancy, and what’s ultimately deliverable by the hardware.
HOW IT WORKS
Users can log in via our easy-to-use, API-driven interface and simply request the hardware resources that he or she requires to run their desired application. JedAI Cloud handles the provisioning, OS deployment, application configuration, scheduling, telemetry, and monitoring and presents the user with an environment that they know and are familiar with.
APPLICATION REPOSITORY
Our built-in software application repository is a portfolio of thousands of containerised simulation-led and data analytics, applications and tools that come pre-integrated and ready to run such as Ansys and OpenFOAM.
AI OPTIMIZED
Our platform includes hpc-optimized capabilities such as secure dedicated clusters that can support collaborative research, virtualized GPUs for accelerating analytical workloads, cloud-native workstations for high-resolution image analysis as well as the integration of AI technologies such as Kubernetes.
A HPC OPTIMIZED PLATFORM
WANT TO KNOW MORE?
TURNKEY & SCALABLE SOLUTION
QUICK ON-SITE DEPLOYMENT
ACCESS TO LATEST AND GREATEST TECH
POWER & SPEED OPTIMIZED
ACCELERATE TIME TO INSIGHT
Featuring the latest generation hardware and JedAI Cloud software, our turnkey offering is built on 3rd Gen AMD EPYC™ Family Processors to maximize workload acceleration, boost memory and performance.
Our expert team has designed low, medium, and high spec cluster solutions optimized for analytical and simulation-lead workloads including computational fluid dynamics(CFD), finite element analysis (FEA), and exploratory data analysis (EDA).
AMD EPYC™ POWERED HARDWARE
CLUSTERS FOR ANY SCALE
Our expert team has designed low, medium, and high spec cluster solutions, optimized for Technical Computing and Simulation-driven workloads.
Low Spec Cluster
Medium Spec Cluster
1x Deployment Node
1x AMD Compute Node
3x Controller Nodes
1x Samsung Storage Node
1x GPU Node
6x Ceph Storage Nodes
JedAI Cloud Software
High Spec Cluster
1x Deployment Node
1x AMD Compute Node
3x Controller Nodes
2x Samsung Storage Node
2x GPU Node
12x Ceph Storage Nodes
JedAI Cloud Software
JedAI BUILDING BLOCKS
TURNKEY CLUSTER HARDWARE
Featuring the latest and most powerful server architecture available on the market
GPU ACCELERATION
Latest gen GPUs
Our Turnkey Cluster solutions offer up to 8x GPUs, delivering unprecedented compute performance to aid the discovery of new drugs, uncover genetic mutations to better fight disease, and drive healthcare innovation.
NVMe Storage
Samsung Storage
High-performing drives from Samsung boost performance and reliability, no matter how intensive the workload.The NVMe storage block comes pre-integrated with a modern file system that accelerates the data pipeline.
AMD COMPUTE
Latest gen CPUs
We offer the latest generation CPU options from industry veterans AMD, built to handle large scientific and engineering datasets with top performance – ideal for HPC workloads, compute-intensive models, and analysis techniques.
Networking
High speed Interconnect
High Performance clusters require flexible, high-speed connections. High speed interconnect accelerates and offloads data transfers to ensure compute resources never “go hungry” and simplifies infrastructure automation so applications run faster.
DESIGNED TO BE THE WORLD’S HIGHEST PERFORMANCE X86 SERVER PROCESSORS FOR TECHNICAL COMPUTING
AMD EPYC™ 7003 SERIES PROCESSORS
AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology triple the amount of available L3 cache to 768MBs per socket versus standard EPYC 7003 series, helping deliver faster time-to-results on targeted workloads like EDA, CFD, and FEA software and solutions while providing socket compatibility with existing AMD EPYC™ 7003 platforms. By increasing the pool of L3 cache that is lower latency and closer to the core than main memory, AMD EPYC™ 7003 Processors with AMD 3D V-Cache utilize the same shared memory architecture as the rest of the 3rd Generation EPYC™ family. That means customers can now take advantage of a full up to 96MB of L3 cache per CCD without sacrificing performance, even on lower core count and mainstream EPYC 7003 processors.
AMD 3D V-CACHE™ TECHNOLOGY
Built on ground-breaking AMD 3D Chiplet architecture and using 7nm process technology, AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology employ leading-edge logic stacking based on copper-to-copper hybrid bonding “bumpless” chip-on-wafer process to enable over 200X the interconnect densities of current 2D CPU technologies (and over 15X the interconnect densities of other 3D CPU technologies using solder bumps), helping lower latency, boost bandwidth, and enhance power and thermal efficiencies.
BREAKTHROUGH PERFORMANCE PER CORE
AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology can run on existing AMD EPYC™ 7003 platforms* and are built to optimize workloads like EDA, CFD, and FEA. Having access to 768MB of L3 cache helps improve performance and speeds up simulation workloads by continuously feeding each processor core up to 96MB of L3 cache per CCD without having to access main memory outside of the CPU.
HELPING TO LOWER TCO
AMD is serious about security. All AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology comes standard with Infinity Guard, a state-of-the-art set of modern security features that help decrease potential attack surfaces as software is booted, executed, and processes your critical data.
EXCEPTIONAL ENERGY EFFICIENCY
AMD is charting a bold path to advance energy efficiency. AMD EPYC™ 7003 Processors with AMD 3D V-Cache are designed with energy efficiency in mind. High performance in technical computing can result in fewer servers deployed while reducing power consumption, real estate needs, administration costs and assisting in the reduction of total cost of ownership..
SIMPLIFIED CLOUD SOLUTIONS
TURNING HARDWARE INTO AN ENGINEERING CLUSTER
JEDAI CLOUD SOFTWARE
When developing a turnkey cluster solution, we adopt a layered approach, starting with the end-user requirements at the application level and working down the stack to the hardware that will ultimately deliver the resources. The goal of our software is to plug the gap between end user expectancy, and what’s ultimately deliverable by the hardware.
HOW IT WORKS
Users can log in via our easy-to-use, API-driven interface and simply request the hardware resources that he or she requires to run their desired application. JedAI Cloud handles the provisioning, OS deployment, application configuration, scheduling, telemetry, and monitoring and presents the user with an environment that they know and are familiar with.
APPLICATION REPOSITORY
Our built-in software application repository is a portfolio of thousands of containerised simulation-led and data analytics, applications and tools that come pre-integrated and ready to run such as Ansys and OpenFOAM.
AI OPTIMIZED
Our platform includes hpc-optimized capabilities such as secure dedicated clusters that can support collaborative research, virtualized GPUs for accelerating analytical workloads, cloud-native workstations for high-resolution image analysis as well as the integration of AI technologies such as Kubernetes.