Turnkey HIGH PERFORMANCE CLUSTERS Powered by AMD EPYC™ Processors with AMD 3D V-Cache™ Technology
ENGINEERING LMX CLUSTER
Powered by ICC hardware, LMX Cloud software, our high performance turnkey Engineering Cluster features 3rd Generation AMD EPYC™ Processors, designed to accelerate CFD, FEA, and EDA workloads at scale.
ACCELERATE TIME TO INSIGHT
Modern engineering design workloads depend on simulation-driven technologies that both ingest and generate huge datasets. With these continually growing datasets comes the continual need for more and more compute power and ultimately a high-performance computing infrastructure. Finding a compromise between cost and research requirements is something we offer with our Turnkey CFD Cluster solutions.
Featuring the latest generation hardware and LMX Cloud software, our turnkey offering is built on 3rd Gen AMD EPYC™ Family Processors to maximize workload acceleration, boost memory and performance.
Our expert team has designed low, medium, and high spec cluster solutions optimized for analytical and simulation-lead workloads including computational fluid dynamics(CFD), finite element analysis (FEA), and exploratory data analysis (EDA).
AMD EPYC™ POWERED Hardware
Clusters for any scale
Our expert team has designed low, medium, and high spec cluster solutions, optimized for Technical Computing and Simulation-driven workloads.
Low Spec Cluster
1x Switch
1x Deployment Node
1x GPU Node
1x Hyper-Converged Node
LMX Cloud Software
Medium Spec Cluster
1x Switch
1x Deployment Node
1x AMD Compute Node
3x Controller Nodes
1x Samsung Storage Node
1x GPU Node
6x Ceph Storage Nodes
LMX Cloud Software
High Spec Cluster
2x Switches
1x Deployment Node
1x AMD Compute Node
3x Controller Nodes
2x Samsung Storage Node
2x GPU Node
12x Ceph Storage Nodes
LMX Cloud Software
LMX Building Blocks
Turnkey Cluster Hardware
Featuring the latest and most powerful server architecture available on the market
GPU ACCELERATION
Latest Gen GPUs
Our Turnkey Cluster solutions offer up to 8x GPUs, delivering unprecedented compute performance to aid the discovery of new drugs, uncover genetic mutations to better fight disease, and drive healthcare innovation.
NVMe STORAGE
NVMe Storage
High-performing drives from Samsung boost performance and reliability, no matter how intensive the workload.The NVMe storage block comes pre-integrated with a modern file system that accelerates the data pipeline.
AMD COMPUTE
Latest Gen CPU options
We offer the latest generation CPU options from industry veterans AMD, built to handle large scientific and engineering datasets with top performance – ideal for HPC workloads, compute-intensive models, and analysis techniques.
NETWORKING
High Speed Interconnect
High Performance clusters require flexible, high-speed connections. High speed interconnect accelerates and offloads data transfers to ensure compute resources never “go hungry” and simplifies infrastructure automation so applications run faster.
Designed to be the World’s Highest Performance x86 Server Processors for Technical Computing
AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology triple the amount of available L3 cache to 768MBs per socket versus standard EPYC 7003 series, helping deliver faster time-to-results on targeted workloads like EDA, CFD, and FEA software and solutions while providing socket compatibility with existing AMD EPYC™ 7003 platforms. By increasing the pool of L3 cache that is lower latency and closer to the core than main memory, AMD EPYC™ 7003 Processors with AMD 3D V-Cache utilize the same shared memory architecture as the rest of the 3rd Generation EPYC™ family. That means customers can now take advantage of a full up to 96MB of L3 cache per CCD without sacrificing performance, even on lower core count and mainstream EPYC 7003 processors.
AMD 3D V-Cache™ technology
Built on ground-breaking AMD 3D Chiplet architecture and using 7nm process technology, AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology employ leading-edge logic stacking based on copper-to-copper hybrid bonding “bumpless” chip-on-wafer process to enable over 200X the interconnect densities of current 2D CPU technologies (and over 15X the interconnect densities of other 3D CPU technologies using solder bumps), helping lower latency, boost bandwidth, and enhance power and thermal efficiencies.
BreAKTHROUGH PERFORMANCE PER CORE
AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology can run on existing AMD EPYC™ 7003 platforms* and are built to optimize workloads like EDA, CFD, and FEA. Having access to 768MB of L3 cache helps improve performance and speeds up simulation workloads by continuously feeding each processor core up to 96MB of L3 cache per CCD without having to access main memory outside of the CPU.
HELPING TO LOWER TCO
AMD 3rd Gen EPYC™ Processors with AMD 3D V-Cache™ technology help customers optimize core usage, license costs and impacts total cost-of-ownership.
THE CONFIDENCE OF MODERN SECURITY
AMD is serious about security. All AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology comes standard with Infinity Guard, a state-of-the-art set of modern security features that help decrease potential attack surfaces as software is booted, executed, and processes your critical data.
EXCEPTIONAL ENERGY EFFICIENCY
AMD is charting a bold path to advance energy efficiency. AMD EPYC™ 7003 Processors with AMD 3D V-Cache are designed with energy efficiency in mind. High performance in technical computing can result in fewer servers deployed while reducing power consumption, real estate needs, administration costs and assisting in the reduction of total cost of ownership.
Regardless of where you are on the journey to becoming more cloud-native, LMX platform can support your workloads at any stage and any scale.
Turning Hardware into an Engineering Cluster
LMX Cloud Software
When developing a turnkey cluster solution, we adopt a layered approach, starting with the end-user requirements at the application level and working down the stack to the hardware that will ultimately deliver the resources. The goal of our software is to plug the gap between end user expectancy, and what’s ultimately deliverable by the hardware.
How it works
Users can log in via our easy-to-use, API-driven interface and simply request the hardware resources that he or she requires to run their desired application. LMX Cloud handles the provisioning, OS deployment, application configuration, scheduling, telemetry, and monitoring and presents the user with an environment that they know and are familiar with.
Application Repository
Our built-in software application repository is a portfolio of thousands of containerised simulation-led and data analytics, applications and tools that come pre-integrated and ready to run such as Ansys and OpenFOAM.
AI-Optimised
Our platform includes hpc-optimized capabilities such as secure dedicated clusters that can support collaborative research, virtualized GPUs for accelerating analytical workloads, cloud-native workstations for high-resolution image analysis as well as the integration of AI technologies such as Kubernetes.
How it works
As a dedicated simulation solutions provider, Ansys leads the industry in physics-based and multi-physics simulation, supporting transformational product development for customers in a broad range of engineering verticals. Ansys gives engineers the power to see how their ideas will perform against millions of variables.
Remote Management Capabilities
Our turnkey HPC solutions can be deployed with the option of a fully managed remote service – enabling your team to focus on its research rather than IT administration. ICC also offers performance benchmarking of solution designs to prove technical compliance and performance and to ensure our customers can make fully informed purchasing decisions.
Private Cloud Software Integration
Not only do our solutions feature bleeding edge technology components (including GPU’s and FPGA’s), ICC can also layer on its own opensource Cloud software which includes an application repository featuring mission critical, containerized applications such as Ansys and tools (i.e. SLURM job schedulers) that come pre-integrated and ready to run – accelerating your time to insight.
SIMULATION SOLUTIONS PATERNERSHIP
ANSYS CERTIFIED TECHNOLOGY PARTNER
We recognize the importance of supporting and integrating industry-leading application stacks that help to simulate complex real-world problems, including Finite Element Analysis (FEA), Computer Aided Engineering (CAD), and Exploratory Data Analysis (EDA). As an Ansys Certified Technology Partner, our solutions include access to a range of Ansys application licenses and support.
How it works
LMX for Engineering
Cloud Driven Analysis
Engineering Use Cases
Computational Fluid Dynamics
The use of a combination of mathematics, physics, and computational software to simulate or visualize how a gas or liquid flows.
Finite Element Analysis
The use of calculations, models, and simulations to predict and understand how an object might behave under various physical forces.
Electronic Design Automation
Electronic design automation (EDA) is the use of computer programs to design, simulate, verify, and manufacture electronic systems
ALTERNATIVE SERVER SOLUTIONS
AMD EPYC SERVER SOLUTIONS
Powered by 3rd Gen AMD EPYC™ Family Processors
ENTERPRISE SERVER
- 1U
- Dual AMD EPYC™ 7003 series processor family
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 32 x dimms
- 2 x 1Gb/s LAN ports (Intel® I350-AM2)
- Onboard 1x M.2
- 8 x 2.5” SATA and 2 x 2.5 NVMe Hot-Swap
- 2 x PCIe Gen4 x16 (Expansion Slots)
1 x OCP 3.0 Gen4 x16 (Mezzanine Slot)
1 x OCP 2.0 Gen3 x8 (Mezzanine Slot) - Redundant 1200W 80 PLUS Platinum
ENTERPRISE SERVER
- 1U
- Dual AMD EPYC™ 7003 series processor family
- Up to 1TB DDR4 2666MHz in 8 dimms
- 2x 1GbE LAN, 1x RJ45 Dedicated IPMI
- Onboard 1x M.2
- 4 x 3.5” Hot-Swap
- 2 x PCIe 3.0 x16 (Full Height, Half Length)
- Redundant 400W
- High Efficiency Platinum
ENTERPRISE SERVER
- 2U
- Dual AMD EPYC™ 7003 series processor family
- Up to 4TB DDR4 2666MHz in 32 x dimms
- 2x GbE LAN, 1x RJ45 Dedicated IPMI
- Onboard 1x M.2
- 24x NVMe Hot-Swap (Front), 2x 2.5″ Hot-Swap (Rear)
- 2 x PCIe 3.0 x16 (Full Height, Half Length)
4 x PCIe 3.0 x8 (Full Height, Half Length)
1 x PCIe 3.0 x8 (Low Profile) - Redundant 1600W 80 PLUS Platinum
STORAGE SERVER
- 4U
- Dual AMD EPYC™ 7003 series processor family
- Up to 2TB DDR4 2666MHz in 16 DIMMS
- Broadcom BCM 57810S
2x 10G SFP+
1x RJ45 Management LAN Port - HW RAID Controller or HBA 1x m.2
- 36x 3.5″ Hot-Swap (Top Loading), 2x 2.5″ Hot-Swap (Rear)
- 4 x PCIe 3.0 x16
3 x PCIe 3.0 x8 - Redundant 1200W 80 PLUS Platinum
GPU SERVER
- 2U
- Dual AMD EPYC™ 7003 series processor family
- Up to 1TB DDR4 2666MHz in 8 dimms
- Mellanox ConnectX-4, 2 x SFP+ 10Gb/s LAN, 1x RJ45 Dedicated IPMI
- Onboard 2x m.2 (x4 and x2)
- 8x 2.5″ Hot-Swap
- 8 PCI-E 3.0 x16 (Double-Width) (Full Height, Full Length)
2 PCI-E 3.0 x16 (Low-Profile) - Redundant 2200W High Efficiency Platinu
HIGH DENSITY SERVER
- 2U – 4 Nodes Twin Server
- Dual AMD EPYC™ 7003 series processor family
- Up to 2TB DDR4 2666MHz in 16 dimms
- 2x 1GbE LAN, 1x RJ45 Dedicated IPMI
- Onboard
1x M.2 - 6x 2.5″ Hot-Swap
- 2x PCIe 3.0 x16 (Low Profile)
1x OCP (Mezzanine Slot) - Redundant 1200W 80 PLUS Platinum
In a recent CRN article, AMD CEO Lisa Su explains how the chipmaker is building ‘workload-optimized’ products like the new 3rd generation EPYC CPUs, optimized for technical computing.
For the new 3rd generation EPYC processors, AMD is using its 3-D stacking technology to create 3-D chiplets that have an additional cache fused on top of the processor – providing on average, a 50 percent performance boost for technical computing workloads compared with the third-generation EPYC CPUs.
Our Brands
Building upon our expertise in delivering market-leading hardware and software solutions, Define Tech will extend ICC’s reach to now support partners, and customers, on a global basis.
