Liquid Cooled HPC Solution
AXIS™ R-725a
ICC has joined forces with AMD and ASETEK to deliver AXIS™, a flexible, proven and reliable liquid cooled solution for High Performance Computing (HPC)
TURNKEY SOLUTION
80KW Per Rack
Maximized Performance
Increased Density / 88 Nodes Per Rack
Energy saving
ICC is #1 in HPC
If higher performance is what you are looking for, ICC has the power and speed to ensure success.
Liquid Cooled HPC Solution
AXIS™ R-725a
ICC provides the design and engineering you need based around power budgets, density and networks configurations.
- Rack-level direct-to-chip (D2C) Cooling
- Increased Compute Performance
- Increased Density
- Decreased Energy Consumption
AMD Integrated HPC Server
1x M.2
1x OCP (Mezzanine Slot)
ASETEK Direct-to-Chip (D2C) Cooling
The ICC AXIS™ servers incorporate Asetek direct-to-chip (D2C) ingredient coolers for dramatic increased data center density and maximum sustained CPU throughput. D2C cooling loops capture between 60-80% of server heat, which is rejected by the Asetek InRackCDU, a warm water cooling distribution unit capable of removing up to 80kW of heat from the rack. The ICC solution with Asetek liquid cooling technology enables high wattage processors in clusters with high interconnect densities, while reducing overall data center cooling costs.
3RD GEN AMD EPYC™
Virtually everything runs better on AMD EPYC™ 7003 Series powered servers. Whether you run enterprise applications, virtualized and cloud computing environments, software-defined infrastructure, high-performance computing, or data analytic applications. EPYC™ processor-based systems are #1 on industry benchmarks, including those measuring integer, floating-point, virtualization, database, and HPC performance.
HIGH-PERFORMANCE LIQUID-COOLED SYSTEMS
RACK-LEVEL DIRECT-TO-CHIP (D2C) Cooling
4,000 Times Better Heat Storage and Transfer
LOWER PROCESSOR TEMPERATURES
Minimized Latency
REDUCED DATA CENTER ENERGY USAGE
BENEFITS & DRAWBACKS
ENERGY SAVING, PERFORMANCE MAXIMIZED LIQUID COOLED HPC SOLUTION
ICC Joins forces with AMD and ASETEK to deliver flexible, proven and reliable rack-level liquid cooled solutions for HPC with increased density and 80kW CDU capacity per rack.
“ICC’s new custom liquid cooling solution enables high performance AMD processors in clusters with high interconnect densities, while reducing overall data center cooling costs,” noted ICC’s Director of Development, Alexey Stolyar, “the energy saving and maximized performance is uniquely suited for the HPC environments.”