Liquid Cooled HPC Solution

TURNKEY SOLUTION
80Kw PER RACK
PERFORMANCE MAXIMIZED
INCREASED DENSITY / 88 NODES PER RACK
Energy Saving

ICC has joined forces with AMD and ASETEK to deliver AXIS™, a flexible, proven and reliable liquid cooled solution for High Performance Computing (HPC)

AXIS™ R-725a

RACK LEVEL DIRECT-TO-CHIP (D2C) COOLING
INCREASED COMPUTE PERFORMANCE
INCREASED DENSITY
DECREASED ENERGY CONSUMPTION
Dense 2U 4-node server platform
Dual AMD EPYC™ 7002 series processor family
8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
2 x 1Gb/s LAN ports (Intel® I350-AM2)
Onboard
2x M.2
4 x 2.5” SATA and 2 x 2.5 NVMe Hot-Swap
4 x PCIe Gen4 x 16 expansion slots
1 x OCP 2.0 Gen3 x16 mezzanine slots
Redundant 2200W 80 PLUS Platinum

ASETEK Direct-to-Chip (D2C) Cooling

The ICC AXIS™ servers incorporate Asetek direct-to-chip (D2C) ingredient coolers for dramatic increased data center density and maximum sustained CPU throughput. D2C cooling loops capture between 60-80% of server heat, which is rejected by the Asetek InRackCDU, a warm water cooling distribution unit capable of removing up to 80kW of heat from the rack. The ICC solution with Asetek liquid cooling technology enables high wattage processors in clusters with high interconnect densities, while reducing overall data center cooling costs.

2ND GEN AMD EPYC™

Virtually everything runs better on AMD EPYC™ 7002 Series powered servers. Whether you run enterprise applications, virtualized and cloud computing environments, software-defined infrastructure, high-performance computing, or data analytic applications. EPYC™ processor-based systems are #1 on industry benchmarks, including those measuring integer, floating-point, virtualization, database, and HPC performance. 

RACK LEVEL DIRECT-TO-CHIP (D2C) COOLING

HIGH-PERFORMANCE LIQUID-COOLED SYSTEMS

4,000 TIMES BETTER HEAT STORAGE AND TRANSFER
MINIMIZED LATENCY
LOWER PROCESSOR TEMPERATURES
REDUCED DATA CENTER ENERGY USAGE

BENEFITS & DRAWBACKS

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