1 877 422 8729

Liquid Cooled HPC Solution

AXIS™ R-725a

ICC has joined forces with AMD and ASETEK to deliver AXIS™, a flexible, proven and reliable liquid cooled solution for High Performance Computing (HPC)

TURNKEY SOLUTION

80KW Per Rack

Maximized Performance

Increased Density / 88 Nodes Per Rack

Energy saving

ICC is #1 in HPC

If higher performance is what you are looking for, ICC has the power and speed to ensure success.

Liquid Cooled HPC Solution

AXIS™ R-725a

ICC provides the design and engineering you need based around power budgets, density and networks configurations.

  • Rack-level direct-to-chip (D2C) Cooling
  • Increased Compute Performance
  • Increased Density
  • Decreased Energy Consumption
AMD Integrated Enterprise Servers

AMD Integrated HPC Server

Form Factor
Processor
RAM
Networking
Storage
NVMe
Cards
NVMe
2U - 4 Nodes Twin Server
Dual AMD EPYC™ 7003 series processor family
Up to 2TB DDR4 2666MHz in 16 dimms
Intel® I350-AM2, 2x 1GbE LAN, 1x RJ45 Dedicated IPMI
Onboard
1x M.2
6x 2.5″ Hot-Swap
2x PCIe 3.0 x16 (Low Profile)
1x OCP (Mezzanine Slot)
Redundant 1200W 80 PLUS Platinum

ASETEK Direct-to-Chip (D2C) Cooling

The ICC AXIS™ servers incorporate Asetek direct-to-chip (D2C) ingredient coolers for dramatic increased data center density and maximum sustained CPU throughput. D2C cooling loops capture between 60-80% of server heat, which is rejected by the Asetek InRackCDU, a warm water cooling distribution unit capable of removing up to 80kW of heat from the rack. The ICC solution with Asetek liquid cooling technology enables high wattage processors in clusters with high interconnect densities, while reducing overall data center cooling costs.

3RD GEN AMD EPYC™

Virtually everything runs better on AMD EPYC™ 7003 Series powered servers. Whether you run enterprise applications, virtualized and cloud computing environments, software-defined infrastructure, high-performance computing, or data analytic applications. EPYC™ processor-based systems are #1 on industry benchmarks, including those measuring integer, floating-point, virtualization, database, and HPC performance. 

HIGH-PERFORMANCE LIQUID-COOLED SYSTEMS

RACK-LEVEL DIRECT-TO-CHIP (D2C) Cooling

Simple and Flexible Storage Solution

4,000 Times Better Heat Storage and Transfer

Scalable Storage

LOWER PROCESSOR TEMPERATURES

Scalable Storage

Minimized Latency

Overclock Servers

REDUCED DATA CENTER ENERGY USAGE

BENEFITS & DRAWBACKS

Press Release

ENERGY SAVING, PERFORMANCE MAXIMIZED LIQUID COOLED HPC SOLUTION

ICC Joins forces with AMD and ASETEK to deliver flexible, proven and reliable rack-level liquid cooled solutions for HPC with increased density and 80kW CDU capacity per rack.

“ICC’s new custom liquid cooling solution enables high performance AMD processors in clusters with high interconnect densities, while reducing overall data center cooling costs,” noted ICC’s Director of Development, Alexey Stolyar, “the energy saving and maximized performance is uniquely suited for the HPC environments.”