TURNKEY SOLUTION
80Kw PER RACK
PERFORMANCE MAXIMIZED
INCREASED DENSITY / 88 NODES PER RACK
Energy Saving
ICC has joined forces with AMD and ASETEK to deliver AXIS™, a flexible, proven and reliable liquid cooled solution for High Performance Computing (HPC)
AXIS™ R-725a
RACK LEVEL DIRECT-TO-CHIP (D2C) COOLING
INCREASED COMPUTE PERFORMANCE
INCREASED DENSITY
DECREASED ENERGY CONSUMPTION
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Dense 2U 4-node server platform |
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Dual AMD EPYC™ 7002 series processor family |
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8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs |
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2 x 1Gb/s LAN ports (Intel® I350-AM2) |
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Onboard 2x M.2 |
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4 x 2.5” SATA and 2 x 2.5 NVMe Hot-Swap |
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4 x PCIe Gen4 x 16 expansion slots 1 x OCP 2.0 Gen3 x16 mezzanine slots |
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Redundant 2200W 80 PLUS Platinum |
ASETEK Direct-to-Chip (D2C) Cooling
The ICC AXIS™ servers incorporate Asetek direct-to-chip (D2C) ingredient coolers for dramatic increased data center density and maximum sustained CPU throughput. D2C cooling loops capture between 60-80% of server heat, which is rejected by the Asetek InRackCDU, a warm water cooling distribution unit capable of removing up to 80kW of heat from the rack. The ICC solution with Asetek liquid cooling technology enables high wattage processors in clusters with high interconnect densities, while reducing overall data center cooling costs.
2ND GEN AMD EPYC™
Virtually everything runs better on AMD EPYC™ 7002 Series powered servers. Whether you run enterprise applications, virtualized and cloud computing environments, software-defined infrastructure, high-performance computing, or data analytic applications. EPYC™ processor-based systems are #1 on industry benchmarks, including those measuring integer, floating-point, virtualization, database, and HPC performance.
RACK LEVEL DIRECT-TO-CHIP (D2C) COOLING
HIGH-PERFORMANCE LIQUID-COOLED SYSTEMS
4,000 TIMES BETTER HEAT STORAGE AND TRANSFER
MINIMIZED LATENCY
LOWER PROCESSOR TEMPERATURES
REDUCED DATA CENTER ENERGY USAGE
BENEFITS & DRAWBACKS
READ PRESS RELEASE
AXIS R-725a– ENERGY SAVING, PERFORMANCE MAXIMIZED LIQUID COOLED HPC SOLUTION.
ICC Joins forces with AMD and ASETEK to deliver flexible, proven and reliable rack-level liquid cooled solutions for HPC with increased density and 80kW CDU capacity per rack.
NORTHBROOK, Illinois – March 25, 2020. International Computer Concepts (ICC), a leading systems integrator of enterprise-level computing solutions, now offers a complete HPC server solution that incorporates Asetek liquid cooling technology and AMD EPYC™ 7002 Series Processor, to increase compute performance and density, while decreasing energy consumption in liquid cooled data centers.