Engineering customers are set to gain ‘Huge Benefits’ from 3rd Generation AMD EPYC CPUs
In a recent CRN article, AMD CEO Lisa Su explains how the chipmaker is building ‘workload-optimized’ products like the new 3rd generation EPYC CPUs, optimized for technical computing.
In a roundtable with journalists in early January, Su said new technologies developed by AMD like 3-D stacking technology are helping the company develop processors that provide a boost for specific workloads over those that serve a broader array of applications. For the new 3rd generation EPYC processors (codenamed Milan-X), AMD is using its 3-D stacking technology to create 3-D chiplets that have an additional cache fused on top of the processor – providing on average, a 50 percent performance boost for technical computing workloads compared with the third-generation EPYC CPUs.
Here at ICC, we look forward to the impending arrival of the new AMD EPYC 3rd Generation chips in the coming weeks, and in anticipation, we have designed a suite of solutions optimized for best performance and efficiency – specifically targeted at engineering workloads.
ICC CTO, Alexey Stolyar, recently told CRN that he expects EPYC customers will see a “huge benefit” for targeted, memory-bound workloads including computational fluid dynamics and electronic design automation.
“We’re really focusing the Milan-X parts around those and with software partners like Ansys, Altair and Siemens to really show the benefit where those CPUs shine,” comments Stolyar.
Stolyar said International Computer Concepts is hoping to expand its HPC customer base by combining AMD EPYC servers with a turnkey HPC software solution called LMX Cloud, which is developed by the company’s European sales and integration representative, Define Tech.
“That’s really the approach that we’ve been doing with AMD: to target a bigger audience that would typically stay away from HPC because it’s too difficult while making it easy and accessible,” he added.
On the subject of supply, Su said the company has made significant investments in capacities for wafers, substrates and back-end-resources. She said the company is also working “much more closely” with customers, which has resulted in the chipmaker receiving forecasts “multiple quarters and, in some cases, multiple years out” for the kind of capacity they need.
Read the full article on CRN here: https://www.crn.com/news/components-peripherals/lisa-su-on-how-amd-is-building-workload-optimized-cpus
To find out more about our range of AMD solutions, including our turnkey LMX cluster for engineering, contact us today.
In a roundtable with journalists in early January, Su said new technologies developed by AMD like 3-D stacking technology are helping the company develop processors that provide a boost for specific workloads over those that serve a broader array of applications. For the new 3rd generation EPYC processors (codenamed Milan-X), AMD is using its 3-D stacking technology to create 3-D chiplets that have an additional cache fused on top of the processor – providing on average, a 50 percent performance boost for technical computing workloads compared with the third-generation EPYC CPUs.
Here at ICC, we look forward to the impending arrival of the new AMD EPYC 3rd Generation chips in the coming weeks, and in anticipation, we have designed a suite of solutions optimized for best performance and efficiency – specifically targeted at engineering workloads.
ICC CTO, Alexey Stolyar, recently told CRN that he expects EPYC customers will see a “huge benefit” for targeted, memory-bound workloads including computational fluid dynamics and electronic design automation.
“We’re really focusing the Milan-X parts around those and with software partners like Ansys, Altair and Siemens to really show the benefit where those CPUs shine,” comments Stolyar.
Stolyar said International Computer Concepts is hoping to expand its HPC customer base by combining AMD EPYC servers with a turnkey HPC software solution called LMX Cloud, which is developed by the company’s European sales and integration representative, Define Tech.
“That’s really the approach that we’ve been doing with AMD: to target a bigger audience that would typically stay away from HPC because it’s too difficult while making it easy and accessible,” he added.
On the subject of supply, Su said the company has made significant investments in capacities for wafers, substrates and back-end-resources. She said the company is also working “much more closely” with customers, which has resulted in the chipmaker receiving forecasts “multiple quarters and, in some cases, multiple years out” for the kind of capacity they need.
Read the full article on CRN here: https://www.crn.com/news/components-peripherals/lisa-su-on-how-amd-is-building-workload-optimized-cpus
To find out more about our range of AMD solutions, including our turnkey LMX cluster for engineering, contact us today.
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Engineering customers are set to gain ‘Huge Benefits’ from 3rd Generation AMD EPYC CPUs
In a recent CRN article, AMD CEO Lisa Su explains how the chipmaker is building ‘workload-optimized’ products like the new 3rd generation EPYC CPUs, optimized for technical computing.
In a roundtable with journalists in early January, Su said new technologies developed by AMD like 3-D stacking technology are helping the company develop processors that provide a boost for specific workloads over those that serve a broader array of applications. For the new 3rd generation EPYC processors (codenamed Milan-X), AMD is using its 3-D stacking technology to create 3-D chiplets that have an additional cache fused on top of the processor – providing on average, a 50 percent performance boost for technical computing workloads compared with the third-generation EPYC CPUs.
Here at ICC, we look forward to the impending arrival of the new AMD EPYC 3rd Generation chips in the coming weeks, and in anticipation, we have designed a suite of solutions optimized for best performance and efficiency – specifically targeted at engineering workloads.
ICC CTO, Alexey Stolyar, recently told CRN that he expects EPYC customers will see a “huge benefit” for targeted, memory-bound workloads including computational fluid dynamics and electronic design automation.
“We’re really focusing the Milan-X parts around those and with software partners like Ansys, Altair and Siemens to really show the benefit where those CPUs shine,” comments Stolyar.
Stolyar said International Computer Concepts is hoping to expand its HPC customer base by combining AMD EPYC servers with a turnkey HPC software solution called LMX Cloud, which is developed by the company’s European sales and integration representative, Define Tech.
“That’s really the approach that we’ve been doing with AMD: to target a bigger audience that would typically stay away from HPC because it’s too difficult while making it easy and accessible,” he added.
On the subject of supply, Su said the company has made significant investments in capacities for wafers, substrates and back-end-resources. She said the company is also working “much more closely” with customers, which has resulted in the chipmaker receiving forecasts “multiple quarters and, in some cases, multiple years out” for the kind of capacity they need.
Read the full article on CRN here: https://www.crn.com/news/components-peripherals/lisa-su-on-how-amd-is-building-workload-optimized-cpus
To find out more about our range of AMD solutions, including our turnkey LMX cluster for engineering, contact us today.
In a roundtable with journalists in early January, Su said new technologies developed by AMD like 3-D stacking technology are helping the company develop processors that provide a boost for specific workloads over those that serve a broader array of applications. For the new 3rd generation EPYC processors (codenamed Milan-X), AMD is using its 3-D stacking technology to create 3-D chiplets that have an additional cache fused on top of the processor – providing on average, a 50 percent performance boost for technical computing workloads compared with the third-generation EPYC CPUs.
Here at ICC, we look forward to the impending arrival of the new AMD EPYC 3rd Generation chips in the coming weeks, and in anticipation, we have designed a suite of solutions optimized for best performance and efficiency – specifically targeted at engineering workloads.
ICC CTO, Alexey Stolyar, recently told CRN that he expects EPYC customers will see a “huge benefit” for targeted, memory-bound workloads including computational fluid dynamics and electronic design automation.
“We’re really focusing the Milan-X parts around those and with software partners like Ansys, Altair and Siemens to really show the benefit where those CPUs shine,” comments Stolyar.
Stolyar said International Computer Concepts is hoping to expand its HPC customer base by combining AMD EPYC servers with a turnkey HPC software solution called LMX Cloud, which is developed by the company’s European sales and integration representative, Define Tech.
“That’s really the approach that we’ve been doing with AMD: to target a bigger audience that would typically stay away from HPC because it’s too difficult while making it easy and accessible,” he added.
On the subject of supply, Su said the company has made significant investments in capacities for wafers, substrates and back-end-resources. She said the company is also working “much more closely” with customers, which has resulted in the chipmaker receiving forecasts “multiple quarters and, in some cases, multiple years out” for the kind of capacity they need.
Read the full article on CRN here: https://www.crn.com/news/components-peripherals/lisa-su-on-how-amd-is-building-workload-optimized-cpus
To find out more about our range of AMD solutions, including our turnkey LMX cluster for engineering, contact us today.