ENGINEERING JEDAI CLUSTER

TURNKEY & SCALABLE SOLUTION

QUICK ON-SITE DEPLOYMENT

ACCESS TO LATEST AND GREATEST TECH

POWER & SPEED OPTIMIZED

AMD EPYC™ POWERED HARDWARE

CLUSTERS FOR ANY SCALE

Our expert team has designed low, medium, and high spec cluster solutions, optimized for Technical Computing and Simulation-driven workloads.

Low Spec Cluster

Medium Spec Cluster

High Spec Cluster

JedAI BUILDING BLOCKS

TURNKEY CLUSTER HARDWARE

Featuring the latest and most powerful server architecture available on the market

GPU ACCELERATION

Latest gen GPUs

Our Turnkey Cluster solutions offer up to 8x GPUs, delivering unprecedented compute performance to aid the discovery of new drugs, uncover genetic mutations to better fight disease, and drive healthcare innovation.

NVMe Storage

Samsung Storage

High-performing drives from Samsung boost performance and reliability, no matter how intensive the workload.The NVMe storage block comes pre-integrated with a modern file system that accelerates the data pipeline.

AMD COMPUTE

Latest gen CPUs

We offer the latest generation CPU options from industry veterans AMD, built to handle large scientific and engineering datasets with top performance – ideal for HPC workloads, compute-intensive models, and analysis techniques.

Networking

High speed Interconnect

High Performance clusters require flexible, high-speed connections. High speed interconnect accelerates and offloads data transfers to ensure compute resources never “go hungry” and simplifies infrastructure automation so applications run faster.

DESIGNED TO BE THE WORLD’S HIGHEST PERFORMANCE X86 SERVER PROCESSORS FOR TECHNICAL COMPUTING

AMD EPYC™ 7003 SERIES PROCESSORS

AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology triple the amount of available L3 cache to 768MBs per socket versus standard EPYC 7003 series, helping deliver faster time-to-results on targeted workloads like EDA, CFD, and FEA software and solutions while providing socket compatibility with existing AMD EPYC™ 7003 platforms. By increasing the pool of L3 cache that is lower latency and closer to the core than main memory, AMD EPYC™ 7003 Processors with AMD 3D V-Cache utilize the same shared memory architecture as the rest of the 3rd Generation EPYC™ family. That means customers can now take advantage of a full up to 96MB of L3 cache per CCD without sacrificing performance, even on lower core count and mainstream EPYC 7003 processors.

AMD 3D V-CACHE™ TECHNOLOGY

Built on ground-breaking AMD 3D Chiplet architecture and using 7nm process technology, AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology employ leading-edge logic stacking based on copper-to-copper hybrid bonding “bumpless” chip-on-wafer process to enable over 200X the interconnect densities of current 2D CPU technologies (and over 15X the interconnect densities of other 3D CPU technologies using solder bumps), helping lower latency, boost bandwidth, and enhance power and thermal efficiencies.

BREAKTHROUGH PERFORMANCE PER CORE

AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology can run on existing AMD EPYC™ 7003 platforms* and are built to optimize workloads like EDA, CFD, and FEA. Having access to 768MB of L3 cache helps improve performance and speeds up simulation workloads by continuously feeding each processor core up to 96MB of L3 cache per CCD without having to access main memory outside of the CPU.

HELPING TO LOWER TCO

AMD is serious about security. All AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology comes standard with Infinity Guard, a state-of-the-art set of modern security features that help decrease potential attack surfaces as software is booted, executed, and processes your critical data.

EXCEPTIONAL ENERGY EFFICIENCY

AMD is charting a bold path to advance energy efficiency. AMD EPYC™ 7003 Processors with AMD 3D V-Cache are designed with energy efficiency in mind. High performance in technical computing can result in fewer servers deployed while reducing power consumption, real estate needs, administration costs and assisting in the reduction of total cost of ownership..