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NORTHBROOK, Illinois – March 21, 2022. International Computer Concepts (ICC), a leading systems integrator of enterprise-level computing solutions announces availability of high-performance systems featuring new 3rd Gen AMD EPYC™ processors with AMD 3D V-Cache™ technology, optimized for engineering workloads including Computational Fluid Dynamics (CFD), Computer Aided Engineering (CAE) and Electronic Design Automation (EDA).

Technical Computing workloads are dependent on simulation-driven technologies that both ingest and generate huge datasets. With these continually growing datasets comes the need for more and more performant compute. Featuring industry leading hardware, Cloud orchestration software and 3rd Gen AMD EPYC processors, ICC’s turnkey solutions are designed to maximize workload acceleration, boost both memory and performance and accelerate time to insights.

The World’s Highest Performance Processors for Technical Computingii: AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology triple the amount of available L3 cache to 768MBs per socket versus standard EPYC 7003 seriesiii, helping deliver faster time-to-results on targeted workloads like EDA, CFD, and FEA software and solutions while providing socket compatibility with existing AMD EPYC™ 7003 platforms.iv By increasing the pool of L3 cache that is lower latency and closer to the core than main memory, AMD EPYC™ 7003 Processors with AMD 3D V-Cache utilize the same shared memory architecture as the rest of the 3rd Generation EPYC™ family. That means customers can now take advantage of a full up to 96MB of L3 cache per CCD without sacrificing performance, even on lower core count and mainstream processors.

“Raising the bar once more for breakthrough performance, 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology accelerate critical product design and technical computing workloads by vertically stacking L3 cache using our ground-breaking packaging technology. This provides the performance and energy efficiency needed for critical, compute-intensive workloads enabling faster time to results,” said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. “3rd Gen AMD EPYC processors with AMD 3D V-Cache technology are also socket compatible with existing 3rd Gen EPYC platforms enabling customers to get up and running quickly and driving better business outcomes.”

“We’re excited to launch a suite of new solutions optimized for best -performance and efficiency – specifically designed for our customers running Technical Computing workloads. Modern engineering applications running at scale are highly dependent on HPC infrastructure. Our innovative turnkey cluster solutions powered by AMD EPYC™ processors and LMX Cloud Orchestration software from our European counterparts Define Tech – are designed to simplify HPC and AI adoption and offer outstanding performance for any memory-bound applications and workloads” adds ICC’s Director of Development, Alexey Stolyar.

For more information on our range of solutions including our range of Turnkey Clusters that are optimized for Technical Computing workloads and powered by 3rd Gen AMD EPYC Processors with AMD 3D V-Cache technology click here.

About International Computer Concepts (ICC) International Computer Concepts (ICC) is a leading provider of IT technology. Since 1993, ICC has been integrating computing systems with the latest hardware and software components to meet the ever-changing business and IT requirements of its clients. With a focus on technical expertise and delivering energy-efficient and high-performance solutions, ICC uses only the best components available to design and assemble computing systems. Based in Northbrook, Illinois, ICC works closely with clients that include local businesses, multinational corporations, institutions of higher learning, and government agencies to equip them with superb computers.

AMD, the AMD Arrow logo, EPYC, 3D V-Cache, and combinations thereof are trademarks of Advanced Micro Devices, Inc.

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i Technical Computing” or “Technical Computing Workloads” as defined by AMD can include: electronic design automation, computational fluid dynamics, finite element analysis, seismic tomography, weather forecasting, quantum mechanics, climate research, molecular modeling, or similar workloads. GD-204

ii MLNX-032: World’s highest performance for technical computing comparison based on AMD internal testing as of 2/14/2022 measuring the rating or jobs/day for each of the application test case simulations average speedup on 2P servers running 32-core EPYC 7573X to 2P servers running 32-core Intel Xeon Platinum 8362 for per-core performance leadership and on 2P servers running top-of-stack 64-core EPYC 7773X to 2P servers running top-of-stack 40-core Intel Xeon Platinum 8380 for density performance leadership and. Results may vary based on factors including silicon version, hardware and software configuration and driver versions.

iii MLNX-12: EPYC™ 7003 Processors with AMD 3D V-Cache have 768MB of L3 Cache, while EPYC 7003 processors without AMD 3D V-Cache have up to 256MB.

iv Processor compatibility with EPYC 7003 powered platforms may require a BIOS update.