SECURE, SCALABLE, RELIABLE & POWERFUL
Turnkey Cluster Solutions
TURNKEY & SCALABLE SOLUTION
QUICK ON-SITE DEPLOYMENT
ACCESS TO LATEST AND GREATEST TECH
POWER & SPEED OPTIMIZED
PREMIER PARTNERS
INNOVATIVE TECHNOLOGY PARTNERS
Our solutions feature bleeding edge technology from industry leading partners
JedAI Building BLOCKS
INDUSTRY LEADING HARDWARE
Featuring the latest and most powerful server architecture available on the market
NVIDIA GPU ACCELERATION
Latest Gen GPUs
Our Turnkey Cluster solutions offer up to 8x GPUs, delivering unprecedented compute performance to aid the discovery of new drugs, uncover genetic mutations to better fight disease, and drive healthcare innovation.
SAMSUNG STORAGE
NVMe Storage
High-performing drives from Samsung boost performance and reliability, no matter how intensive the workload.The NVMe storage block comes pre-integrated with a modern file system that accelerates the data pipeline.
AMD COMPUTE
Latest Gen CPU Options
We offer the latest generation CPU options from industry veterans AMD, built to handle large scientific and engineering datasets with top performance – ideal for HPC workloads, compute-intensive models, and analysis techniques.
Mellanox Networking
High Speed Interconnect
High Performance clusters require flexible, high-speed connections. High speed interconnect accelerates and offloads data transfers to ensure compute resources never “go hungry” and simplifies infrastructure automation so applications run faster.
Broadcast & Media Use Cases
LOW LATENCY VIDEO
Deliver high-quality, low-latency video content using storage, networking, compute and GPU-accelerated infrastructure
SECURE COLLABORATION
Create and collaborate on post-production workflows seamlessly and securely in the cloud.
REMOTE PRODUCTION INFRASTRUCTURE
Enable your secure remote production infrastructure and process traditional broadcast apps in the cloud, to reduce costs and complexity
ENGINEERING Use Cases
COMPUTATIONAL FLUID DYNAMICS
The use of a combination of mathematics, physics, and computational software to simulate or visualize how a gas or liquid flows.
FINITE ELEMENT ANALYSIS
The use of calculations, models, and simulations to predict and understand how an object might behave under various physical forces.
ELECTRONIC DESIGN AUTOMATION
Electronic design automation (EDA) is the use of computer programs to design, simulate, verify, and manufacture electronic systems
Life Science Use Cases
GENOMIC SEQUENCING
Genome or Genomic sequencing is the study of our DNA with the goal of identifying mutations that can cause disease.
MEDICAL IMAGING
Combining HPC resources with deep learning algorithms can improve the recognition of complicated patterns in Medical images such as MRI, CAT scans.
DISEASE BEHAVIOUR AND PREVENTION
The study of the breakdown and behaviour of viruses through intense data analytics and simulated environments.
FINANCE Use Cases
HIGH FREQUENCY TRADING
The practice of utilizing powerful computing platforms and complex algorithms to analyze markets and buy or sell shares in seconds.
RISK MODELLING
Financial risk modeling is the use of a set of formally recognized techniques to determine the probable risk in a financial portfolio.
QUANTITATIVE ANALYSIS
Quantitative analysis is the process of using financial ratio calculations to gain insight into the valuation of a specific company or broad market.
HIGH PERFORMANCE HARDWARE
CLUSTERS FOR ANY SCALE
LOW SPEC CLUSTER
MEDIUM SPEC CLUSTER
1x Deployment Node
1x Compute Node
3x Controller Nodes
1x Storage Node
1x GPU Node
6x Ceph Storage Nodes
JedAI Cloud Software
HIGH SPEC CLUSTER
1x Deployment Node
1x Compute Node
3x Controller Nodes
2x Storage Node
2x GPU Node
12x Ceph Storage Nodes
JedAI Cloud Software
BOLT-ON ANY HARDWARE
VERTICAL SPECIFIC SOLUTIONS
MEDIA WORKSTATIONS
LQC Workstation
LPC Workstation
Featuring Ryzen™ Threadripper™ PRO – the ultimate workstation processors – and Samsung M.2 storage delivering a productivity boosting engine and ultimate storage at the heart of our professional workstation solutions
AMD EPYC SERVER
AMD EPYC™ 7003 SERIES PROCESSORS
AMD 3D V-Cache™ technology
Built on ground-breaking AMD 3D Chiplet architecture and using 7nm process technology, AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology employ leading-edge logic stacking based on copper-to-copper hybrid bonding “bumpless” chip-on-wafer process to enable over 200X the interconnect densities of current 2D CPU technologies (and over 15X the interconnect densities of other 3D CPU technologies using solder bumps), helping lower latency, boost bandwidth, and enhance power and thermal efficiencies.
HIGH PERFORMANCE, SCALABLE SOLUTIONS DESIGNED FOR YOUR NEEDS
VERTICAL SPECIFIC CLUSTER SOLUTIONS
WANT TO KNOW MORE?
TURNKEY & SCALABLE SOLUTION
QUICK ON-SITE DEPLOYMENT
ACCESS TO LATEST AND GREATEST TECH
POWER & SPEED OPTIMIZED
PREMIER PARTNERS
INNOVATIVE TECHNOLOGY PARTNERS
Our solutions feature bleeding edge technology from industry leading partners
JedAi Building BLOCKS
INDUSTRY LEADING HARDWARE
Featuring the latest and most powerful server architecture available on the market
NVIDIA GPU ACCELERATION
Latest Gen GPUs
Our Turnkey Cluster solutions offer up to 8x GPUs, delivering unprecedented compute performance to aid the discovery of new drugs, uncover genetic mutations to better fight disease, and drive healthcare innovation.
SAMSUNG STORAGE
NVMe Storage
High-performing drives from Samsung boost performance and reliability, no matter how intensive the workload.The NVMe storage block comes pre-integrated with a modern file system that accelerates the data pipeline.
AMD COMPUTE
Latest Gen CPU Options
We offer the latest generation CPU options from industry veterans AMD, built to handle large scientific and engineering datasets with top performance – ideal for HPC workloads, compute-intensive models, and analysis techniques.
Mellanox Networking
High Speed Interconnect
High Performance clusters require flexible, high-speed connections. High speed interconnect accelerates and offloads data transfers to ensure compute resources never “go hungry” and simplifies infrastructure automation so applications run faster.
Broadcast & Media Use Cases
LOW LATENCY VIDEO
Deliver high-quality, low-latency video content using storage, networking, compute and GPU-accelerated infrastructure
SECURE COLLABORATION
Create and collaborate on post-production workflows seamlessly and securely in the cloud.
REMOTE PRODUCTION INFRASTRUCTURE
Enable your secure remote production infrastructure and process traditional broadcast apps in the cloud, to reduce costs and complexity
ENGINEERING Use Cases
COMPUTATIONAL FLUID DYNAMICS
The use of a combination of mathematics, physics, and computational software to simulate or visualize how a gas or liquid flows.
FINITE ELEMENT ANALYSIS
The use of calculations, models, and simulations to predict and understand how an object might behave under various physical forces.
ELECTRONIC DESIGN AUTOMATION
Electronic design automation (EDA) is the use of computer programs to design, simulate, verify, and manufacture electronic systems
Life Science Use Cases
GENOMIC SEQUENCING
Genome or Genomic sequencing is the study of our DNA with the goal of identifying mutations that can cause disease.
MEDICAL IMAGING
Combining HPC resources with deep learning algorithms can improve the recognition of complicated patterns in Medical images such as MRI, CAT scans.
DISEASE BEHAVIOUR AND PREVENTION
The study of the breakdown and behaviour of viruses through intense data analytics and simulated environments.
FINANCE Use Cases
HIGH FREQUENCY TRADING
The practice of utilizing powerful computing platforms and complex algorithms to analyze markets and buy or sell shares in seconds.
RISK MODELLING
Financial risk modeling is the use of a set of formally recognized techniques to determine the probable risk in a financial portfolio.
QUANTITATIVE ANALYSIS
Quantitative analysis is the process of using financial ratio calculations to gain insight into the valuation of a specific company or broad market.
HIGH PERFORMANCE HARDWARE
CLUSTERS FOR ANY SCALE
LOW SPEC CLUSTER
MEDIUM SPEC CLUSTER
1x Deployment Node
1x Compute Node
3x Controller Nodes
1x Storage Node
1x GPU Node
6x Ceph Storage Nodes
JedAI Cloud Software
HIGH SPEC CLUSTER
1x Deployment Node
1x Compute Node
3x Controller Nodes
2x Storage Node
2x GPU Node
12x Ceph Storage Nodes
JedAI Cloud Software
BOLT-ON ANY HARDWARE
VERTICAL SPECIFIC SOLUTIONS
MEDIA WORKSTATIONS
Our Cluster solutions can also be built around mission-critical or vertical-specific hardware outside of our building block range.LQC Workstation
LIQUID COOLED WORKSTATION OPTIMISED FOR DESIGN, MODELING & SIMULATIONFeaturing AMD Ryzen™ Threadripper™ PRO – the ultimate workstation processors – and Samsung M.2 storage, delivering a productivity boosting engine and ultimate storage at the heart of our professional workstation solutions
LPC Workstation
CUSTOM LOOP COOLED WORKSTATION OPTIMISED FOR DESIGN, MODELING & SIMULATIONFeaturing Ryzen™ Threadripper™ PRO – the ultimate workstation processors – and Samsung M.2 storage delivering a productivity boosting engine and ultimate storage at the heart of our professional workstation solutions
AMD EPYC SERVER
Our Cluster solutions can also be built around mission-critical or vertical-specific hardware outside of our building block range.AMD EPYC™ 7003 SERIES PROCESSORS
AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology can run on existing AMD EPYC™ 7003 platforms* and are built to optimize workloads like EDA, CFD, and FEA. Having access to 768MB of L3 cache helps improve performance and speeds up simulation workloads by continuously feeding each processor core up to 96MB of L3 cache per CCD without having to access main memory outside of the CPU.AMD 3D V-Cache™ technology
Built on ground-breaking AMD 3D Chiplet architecture and using 7nm process technology, AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology employ leading-edge logic stacking based on copper-to-copper hybrid bonding “bumpless” chip-on-wafer process to enable over 200X the interconnect densities of current 2D CPU technologies (and over 15X the interconnect densities of other 3D CPU technologies using solder bumps), helping lower latency, boost bandwidth, and enhance power and thermal efficiencies.